Minalogic

Why choose France?

Minalogic

Situated in the southeast of France in the Rhône-Alpes Region, the “Minalogic” innovative cluster is specialized in the fields of Microelectronics, Micro-nanotechnologies and Embedded Software.

The “Minalogic” cluster is divided into 2 working groups or “clusters” called EmSoC (embedded software) and Micro-nanotechnologies. Both have the same strategy:

to construct the leading European cluster and one of the three biggest clusters at a worldwide level for intelligent miniaturized microchips
to promote these technological advances in the industrial sectors which can draw a competitive advantage from the intelligent miniaturized solutions

Advantages

The Rhône-Alpes Region is one of the most dynamic and prosperous regions of Europe (2nd in France behind the Paris (Ile-de-France) region). If offers efficient access to the biggest industrial centres of the north and south of the continent.

Members

Over 120 members of the cluster

Plus 19 other organizations, including the Rhône-Alpes Region, the General Councils of Isère, Haute-Savoie, Drôme and Loire, Towns of Grenoble, Saint-Etienne, Crolles and Lyon, Chambers of Commerce and Industry of Grenoble and Drôme, European Electronic Chips & Systems Initiative (ECSI).

Companies 85
French groups: Adixen (Alcatel), Air Liquide, Biomérieux, Bull, Essilor, France Telecom, Gaz Electricité de Grenoble, Porcher Industrie, Schneider Electric, Orange Business Services, Sogeti, ST Microelectronics, Thalès.

International groups: e2v (United Kingdom), Freescale Semiconductor (United States), Hewlett Packard (United States), Memscap (France and United States), ST Microelectronics (Dutch company in France and Italy), Xerox (United States).

Research and Training Centres
13, including the Commissariat à l’Energie Atomique (CEA), University Hospital of Grenoble (CHU), Centre National de la Recherche Scientifique (CNRS), Université Claude Bernard of Lyon, Université Joseph Fourier Grenoble I, University of Savoie Annecy-Chambéry.

Current R&D Partnerships

Over 111 projects accredited since 2005 for an overall budget of over 1.2 billion euros (refer to appendix) and 77 selected for public financing
- 189 million euros allocated by the Agence de l’Innovation Industrielle (AII)
- 108 million euros allocated to the cluster via the FUI between 2005 and 2008
- Over 43 million euros by the ANR over the same period
- Over 12 million euros by OSEO

The government will grant nearly 400 million euros between 2009 and 2014 toward the financing of the “Crolles 3” Program, which is aimed at the construction of a European Nanoelectronics Research Center.
Over 2.5 billion euros of private investment are expected for this project.

International Partnerships

Current- Growth Initiative for Nanoelectronics (GIN) Program and European Master with Germany, Belgium and the Netherlands
- Coopération Commissariat à l’Energie Atomique, Laboratoire Léti et Fraunhoffer, Dresden, Germany and NanoQuébec
- European Master (micro-nano for integrated systems) with Italy and Sweden

Future- Nanotech partnership between companies within the framework of Crolles 2 (Nanoelectronics research complex) with the United States.
- Partnership between Crolles 2 and CINVESTAV (Advanced Studies and Research Centre of the Institut Polytechnique National) of Guadalajara, Mexico
- Participation in Medea, European Research & Development Initiative in microelectronic products.

Examples of Certified R&D Innovative Projects

Name and Subject of the Project

Examples of Micro-Nanotechnology Projects (13)

DELPIX

Rapid RX tomography project for quality control of parts on production chains

FAST

Switchable RF filters into BAW technology for mobile communication systems

FOREMOST

Assembly and integration of a full CMOS 45nm device

IMALOGIC

Professional imagers

MINIIMAGE

General public imagers

NANOSMART CENTER

Advanced substrates for microelectronics

REVAMETIC

Development of an innovative and environmentally friendly process which enables the treatment and recycling of concentrated metal effluents

VIS IMALOGIC

Imagers in the field of the visible for professional applications

CRISTAL

Structural control of metals with nanometric dimensions

Application to the control of resistance in microelectronic interconnections

EXTRADA

Design, manufacture and EXploration of a nanometric TRAnsistor on an SOI with a Dielectric Alternative constrained to high thermal conductivity

LORS

Software for robust and rapid optimization for the scatterometry of nanometric 3D objects

NEUROLOINK

Neuronal/micro-electrode network interface at high performances and increased stability for electrophysiological recording

QUANTAMONDE

QUANTum and Atomistic MOdeling of NanoDEvices

Examples of Embedded Software Projects (18)

To protect/reinforce competitiveness through substantial gains in productivity and quality, in the production of embedded software microchips

ALPSPOT

Miniaturized communication system for geolocation and secure transmission of physiological data, ultra-low power

ARAVIS

Multiple-processor homogenous asynchronous reconfigurable architecture for high-performance calculation in embedded equipment (asynchronous SoC in 45, 32 and 22 nm)

ATHOLE

Low power data flow Orientated Heterogeneous multi-processing architecture based on Network on Chip (NoC) for the Embedded system

CAPRI

Tools for design of wireless sensor networks

CILOE

Parallelization of test phases and simulation of architectures and embedded systems

IGLANCE

Creation of a demonstration platform for HD and 3D television

MCUBE

Services environment for M2M infrastructure

MIND

Technology for assembly of embedded software components that is fundamental, effective, robust and adaptable to the business line issues of the sector

MULTIVAL

Multi-processor platforms

NOMAD

Innovative concepts of Man/Machine Interaction on embedded objects

OPENTLM

Asynchronous modelling/validation of SoC

SAMEE

Devices for advanced display in the various fields of application of electrical distribution

SCEPTRE

Techniques for implementation on SoC

SECTOCKEN

Developing an integrated safety circuit including a specific secured micro-controller

SOCKET

Establishment of a smooth design flow, development processes and methodologies compatible with operational safety requirements and the qualification/certification processes

VERISOC

Platform for functional verification of heterogeneous SoC

VIDEO4ALL/IMANUM

High-performance algorithm for H264 and AVC video encoding for mounted embedded electronics

CAPRI/FEC

Design and analysis of Application-Level Forward Error Correction (AL-FEC) codes and application to mobile communications

Promotion in the industrial sectors (7 projects)

Applications of nanotechnologies in industry

CARE@HOME

Embedded and environmental sensor networks for domestic support

PAPIER INTELLIGENT

Packaging recording the history of the conditions suffered by an object, integration of microchips, aerials and batteries

RFID Paper

RFID labels printing on paper

PRINTRONICS

Industrial production of printed

polymer electronic components

SMART ELECTRICITY

Products and services for energy efficiency

SURGIMAG

Miniaturization of surgical procedure assistance units through the use of magnetic micro-sensors, medicalized tablet PC and adapted embedded software

VETEC

Communications infrastructure and protocols for future communicating land vehicles (sensors, network of sensors and communications infrastructure for traffic security)